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Numerical Modelling of Sample : Furnace Thermal Lag in Dynamic Mechanical Analyser (CROSBI ID 144836)

Prilog u časopisu | izvorni znanstveni rad | međunarodna recenzija

Sućeska, Muhamed ; Zhi-Yue, Liu ; Matečić Mušanić, Sanja ; Fiamengo, Ivona Numerical Modelling of Sample : Furnace Thermal Lag in Dynamic Mechanical Analyser // Journal of thermal analysis and calorimetry, 100 (2010), 1; 337-345. doi: 10.1007/s10973-009-0447-z

Podaci o odgovornosti

Sućeska, Muhamed ; Zhi-Yue, Liu ; Matečić Mušanić, Sanja ; Fiamengo, Ivona

engleski

Numerical Modelling of Sample : Furnace Thermal Lag in Dynamic Mechanical Analyser

Due to dynamic nature of processes taking place during the experiment (chemical reaction and physical processes, heat flow, gas flow, etc.) the results obtained by thermal methods may considerably depend on the conditions used during the experiment. Therefore, whenever the results of thermal analysis are reported, the experimental conditions used should be stated. In this paper we have studied the heat transfer from the furnace to the sample and through the sample during dynamic mechanical analysis (DMA) measurements. Numerical modelling of the heat transfer was done using an own computer program based on the heat conduction equation, solved numerically applying the finite difference methods. The calculated values of the thermal lag between the furnace and the sample were compared with the values experimentally determined on samples of a composite polymeric energetic material (double-base rocket propellant). Also, the temperature distribution within the sample as a function of the heating rate was analysed using the same numerical model. It was found out that using this model and temperature dependent heat transfer coefficient, experimentally obtained values of the thermal lag between the furnace and the sample can be satisfactory described. It was also shown that even at slow heating rates, such is e.g. 2 oC min-1, the thermal lag between the furnace and the sample can reach several degrees, while the thermal gradient within 3 mm thick rectangular sample can reach 0.4 oC

thermal methods; dynamic mechanical analysis; heat conduction equation; thermal lag; thermal gradient; heat transfer coefficient

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Podaci o izdanju

100 (1)

2010.

337-345

objavljeno

1388-6150

10.1007/s10973-009-0447-z

Povezanost rada

Kemija, Kemijsko inženjerstvo

Poveznice
Indeksiranost